TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
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With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
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Density: 2.9 g/cm3
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Viscosity: 47 Pa-s
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Thermal impedance: 0.035°C -in2/W
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Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
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This thermal compound application kit includes a set of easily-applied tools for immediate use.
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