TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
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The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
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Density: 2.55 g/cm3
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Viscosity: 76 Pa-s
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Thermal impedance: 0.185°C -in2/W
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Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
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The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
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